Laminates and Prepregs
RoHS compliant copper clad laminates, including dicy-free laminates for lead free PCB assembly, polyimide laminates for high performance multilayer PCBs, high frequency and microwave materials and aramid reinforced electronic substrates.
Standard Epoxy Materials >
Our range of FR4 grade Epoxy/glass laminates and prepregs includes both traditional Dicy cured 135Tg and 140Tg options…
High Speed Digital >
Low dielectric constant, low loss multilayer thermoset laminates and prepregs for high speed digital applications demanding lower loss…
Green (Halogen free) Laminates >
Halogen free epoxy resin copper clad laminates and prepregs.
No Flow Prepregs >
A range of epoxy and polyimide prepregs with controlled flow properties for heat sink bonding and flex-rigid multilayer…
High Performance (Polyimide) >
Polyimide laminates, prepregs and hole filling materials for high performance, high Tg multilayer printed circuit boards.
RF Microwave >
PTFE based laminates reinforced with glass fibre in a range of options of dielectric constant and dissipation factor…
Thermally Reliable Epoxy Materials >
Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Such…