Isola P96/26
Isola offers a product line of polyimide-based prepreg (P26) and core material (P96) for high temperature printed circuit applications. These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend system, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
SPECIFICATIONS
- High thermal performance – Tg:260C (TMA), Greater thermal performance over epoxy-bismaleimide blends
- T260: 60 minutes
- T288: 60 minutes
- RoHS Compliant
- Maintains Bond Strength at High Temperature
- Tough Resin System- Improved processing due to less brittleness, Less delamination from machining
- Brominated chemistry, Thermal Stable Laminate System
- Non-MDA (Methylenedianiline) Chemistry
- Core Material Standard Availability – Thickness 0.05mm to 3.2mm, Available in full size sheet or panel form Prepreg Standard Availability – Roll or panel form, Tooling of prepreg panels available
- Copper Foil Type Availability – Standard HTE Grade 3, RTF (Reverse Treat Foil)
- Copper weights – 1/2, 1 and 2 oz (18, 35 and 70 micron) available, Heavier copper available upon request, Thinner copper foil available upon request
- Glass Fabric Availability – Standard E-glass
- Industry Approvals – IPC-4101C/40 /41 /42, UL- File Number E41625