Isola P96/26

Isola offers a product line of polyimide-based prepreg (P26) and core material (P96) for high temperature printed circuit applications. These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend system, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.


  • High thermal performance – Tg:260C (TMA), Greater thermal performance over epoxy-bismaleimide blends
  • T260: 60 minutes
  • T288: 60 minutes
  • RoHS Compliant
  • Maintains Bond Strength at High Temperature
  • Tough Resin System- Improved processing due to less brittleness, Less delamination from machining
  • Brominated chemistry, Thermal Stable Laminate System
  • Non-MDA (Methylenedianiline) Chemistry
  • Core Material Standard Availability – Thickness 0.05mm to 3.2mm, Available in full size sheet or panel form Prepreg Standard Availability – Roll or panel form, Tooling of prepreg panels available
  • Copper Foil Type Availability – Standard HTE Grade 3, RTF (Reverse Treat Foil)
  • Copper weights – 1/2, 1 and 2 oz (18, 35 and 70 micron) available, Heavier copper available upon request, Thinner copper foil available upon request
  • Glass Fabric Availability – Standard E-glass
  • Industry Approvals – IPC-4101C/40 /41 /42, UL- File Number E41625