Isola P25N
Isola offers a P25N product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.
These products consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset
polyimides.
SPECIFICATIONS
- Product Features
- Industry Recognition
- – UL File Number: E41625
- RoHS Compliant
- Performance Attributes
- Lead-free assembly compatible
- Processing Advantages
- Minimal, uniform resin flow
- No-flow Prepreg
- Adhesion to wide range of materials
- Flex films
- Treated or untreated copper
- Plated metals ( tin, solder, nickel etc)
- Conventional laminate surfaces
- Product Availability
- Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
- Glass Fabric Availability
- E-glass
- Standard Material Offering: Prepreg
- Industry Recognition