Espanex M Series
Adhesiveless polyimide flexible copper clad laminate with enhanced features:
- Conforms to IPC4204/25
- Excellent dimensional stability
- Excellent heat resistance, compatible with lead free solder process
- Specific grades offer Standard or High Flex Endurance Copper combined with Standard Polyimide or Low Modulus Copper to suit particular applications
SPECIFICATIONS
M Series, Single-sided copper clad polyimide Laminate
| Grade | Copper thickness (microns) | Polyimide thickness (microns) | Features |
|---|---|---|---|
| MC12-12-00REM | 12 | 12 | High Flex ED Copper/ M Type Polyimide |
| MC12-20-00CEM | 12 | 20 | ED Copper/ M Type Polyimide |
| MC12-25-00CEM | 12 | 25 | ED Copper/ M Type Polyimide |
| MC18-25-00CEM | 18 | 25 | ED Copper/ M Type Polyimide |
| MC18-25-00FRM | 18 | 25 | RA Copper/ M Type Polyimide |
Espanex™ copper clad flexible laminate is available in rolls 500mm wide x 100 linear metres nominal and in panels cut to customer requirements. The machine direction of Rolled Annealed copper (RA) is parallel to the roll length.
M Series, Double-sided copper clad polyimide Laminate
| Grade | Copper thickness (microns) | Polyimide thickness (microns) | Features |
|---|---|---|---|
| MB12-09-12REG | 12 | 09 | High Flex ED Copper/ G Type Polyimide |
| MB09-12-09REG | 09 | 12 | High Flex ED Copper/ G Type Polyimide |
| MB12-12-12REG | 12 | 12 | High Flex ED Copper/ G Type Polyimide |
| MB09-20-09REG | 09 | 20 | High Flex ED Copper/ G Type Polyimide |
| MB12-25-12CEG | 12 | 25 | ED Copper/ G Type Polyimide |
| MB18-25-18CEG | 18 | 25 | ED Copper/ G Type Polyimide |
| MB18-25-18FRG | 18 | 25 | RA Copper/ G Type Polyimide |
| MB12-50-12REQ | 18 | 25 | High Flex ED Copper/ G Type Polyimide |
Espanex™ copper clad flexible laminate is available in rolls 500mm wide x 100 linear metres nominal and in panels cut to customer requirements. The machine direction of Rolled Annealed copper (RA) is parallel to the roll length.
| Property | Units | Typical values (MC18-25-00) | Test method |
|---|---|---|---|
| Tensile strength | MPa | 300 | IPC-TM-650, 2.4.19 |
| Tensile elongation | % | 50 | IPC-TM-650, 2.4.19 |
| Tensile modulus | MPa | 6500 | IPC-TM-650, 2.4.19 |
| Peel strength (Initial) | kN/m | 1.5 | JIS C-5012 |
| Peel strength (After Ageing) | kN/m | No Data | 150°C, 7 days |
| Shrinkage after etch (MD) | % | 0.02 | – |
| Shrinkage after etch (TD) | % | 0.02 | – |
| Thermal Shrinkage (MD) | % | -0.03 | 250°C, 30 min |
| Thermal Shrinkage (TD) | % | -0.03 | 250°C, 30 min |
| Insulation resistance | MΩ | 1 x 108 | IPC-TM-650, 2.5.9 |
| Volume resiustivity | MΩ x cm | 1 x 109 | IPC-TM-650, 2.5.17 |
| Dielectric strength | kV/mil | >=5 | ASTM-D-149 |
| Solder float resistance | °C | 400 | 1 min dipping |
| Flammability | – | V0 | UL-94 |
NOTES
General safety information
- Only use the product for applications described in the product data sheet
- The product is intended for industrial use only
- The product is not suitable for food industry
- The product must not be eaten
- In case of fire noxious fumes or smoke can be generated
Danger
- Dust generation, do not inhale dust, comply with general dust limit value TRGS 553
- Do not inhale fumes or smoke created during processing or by fire
Protection methods
- Dust extraction or dust protection mask
Extinguishing agent
- Foam, powder, CO2
Environment
- Comply with limit value for respirable dust
- Dispose or waste safely
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